Methods of accommodating

Posted by / 04-Dec-2017 13:28

to mating surfaces of the sheathing casings, but to position the sheathing casings accurately when the sheathing casings become compact for sheathing electronic components small in size.Furthermore, the prior art sheathing method has such disadvantages as requirements for long curing time, high curing temperature, low production efficiency, etc.1 is an exploded perspective view of casings for accommodating therein an electronic component attached to a terminal frame, which are employed in a method proposed in Japanese Patent Application No. 2 is a view explanatory of assembly of the electronic component accommodated in the casings of FIG. 3 is a top plan view of a terminal frame which is a modification of the terminal frame of FIG. 4 is an exploded perspective view of casings for accommodating therein an electronic component attached to a terminal frame, which are employed in a method according to one preferred embodiment of the present invention; FIG.5 is a view explanatory of assembly of the electronic component accommodated in the casings of FIG. 6 is a top plan view of a terminal frame plate for connecting a plurality of the terminal frames of FIG. Before the description of the present invention proceeds, it is to be noted that like parts are designated by like reference numerals through several views of the accompanying drawings. 4 to 6, in a method for accommodating an electronic component in a casing, according to one preferred embodiment of the present invention, an acoustic vibrator 60 secured to a terminal frame 52 is accommodated in a pair of a first sheathing casing 70 and a second sheathing casing 72 attached to each other.

117315/1982 (Tokugansho 57-117315) filed on July 5, 1982, of which the present inventor is one of the co-inventors and which is assigned to the same assignee as the present case.

It is to be further noted that the piezoelectric film 18 disposed under the lead electrode film 19b and the outlet electrode film 19c functions as an insulating layer.

Meanwhile, the terminal frame 12 has a frame portion of substantially square annular shape and includes a pair of U-shaped projections 21a and 21d projecting outwardly from opposite ends of one side of the frame portion in parallel with each other, a pair of U-shaped projections 21b and 21c projecting outwardly from opposite ends of the other side of the frame portion in alignment with the projections 21a and 21d, respectively, supporting pieces 20a, 20b, 20c and 20d protruding inwardly from the terminal frame 12 and disposed adjacent to the projections 21a, 21b, 21c and 21d, respectively, and lead terminals 22a, 22b, 22c and 22d projecting outwardly from the projections 21a, 21b, 21c and 21d in the same directions as the projections 21a, 21b, 21c and 21d, respectively. 1 each are formed into a square plate by molding thermoplastic resin such as polycarbonate, polyacetal, polyethylene, etc.

Subsequently, when, for example, the leg portion 21a2 disposed inwardly of the leg portion 21a2 of the projection 21a and the leg portion 21b2 disposed inwardly of the leg portion 21b1 of the projection 21b are cut off as shown in dotted lines in FIG.

2, the lead terminals 22a and 22b are electrically conducted to the drive electrode film 19a, and the lead terminals 22c and 22d are electrically conducted to the acoustic vibrator body 17.

methods of accommodating-69methods of accommodating-49methods of accommodating-69

Thus, in order to sheathe or encapsulate the elements themselves of the electronic components of this kind, it has been conventionally so arranged that a pair of sheathing casings made of ceramic and having a hollow structure are bonded to each other by the use of low-melting glass, adhesive, etc.

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